WSS(wafer support system)晶圆承载系统拉斯维加斯手机版登入 - 拉斯维加斯手机版登入_拉斯维加斯平台_拉斯维加斯在线线路检测

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    WSS(wafer support system)晶圆承载系统2020-01-13  浏览次数:

    WSS(wafer support system)晶圆承载系统。


    WSS晶圆承载系统提供了一个临时的键合解决方案,方案用于晶圆减薄工艺和减薄后工艺期间对晶圆的支撑。

    The Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations.


    这个方案是在真空环境下,通过在晶圆表面旋涂UV粘合剂,再进行UV固化的方式,实现玻璃与晶圆之间的临时键合。因为是真空环境,所以可以保证晶圆和玻璃之间不会产生气泡。

    The  UV curable adhesive is spun on the wafer surface and is used as a bonding agent between the glass support substrate and the wafer. The mounting process is performed under vacuum ensuring that no bubbles are entrapped between the wafer and the support glass. Grinding stress to the wafer can be minimized because the UV-curable adhesive flows into and supports the topography of the circuit patterns on the front side of the wafer.


    WSS这种均匀的支撑方式可以使得晶圆减薄后的最小厚度能够达到20微米,且在晶圆减薄后,玻璃载板可支持晶圆减薄后的任何工艺,如蚀刻、CMP(化学机械研磨)、金属沉积等,同时也能够轻松地将晶圆转移到切割胶带或切割框架上,只需要通过激光进行脱胶处理,便可剥离、移除玻璃载板。

    This uniform support allows wafer thinning to less than 20µm final thickness.After wafer thinning, the glass substrate provides support for any post grind processes such as etch, CMP, metal deposition or simple transfer to dicing tape and frame where the glass substrate is removed by laser debonding of the adhesive-glass interface. And thinning the wafer is only one step in our process offerings. 



    image.png

    1)安装(在晶圆上旋涂UV胶;通过真空环境与玻璃键合到一起;紫外线照射固化)

    1)Mount(Spin coat UV resin on wafer; vacuum bond to support glass; UV irradiate)

    image.png


    2)使用常规研磨方法进行背面研磨

    2)Backgrind using conventional grind methods

    image.png

    晶圆减薄研磨期间、之后都能够得到均匀、充分的支撑,保证操作安全。

    Thinned wafer is fully supported after backgrind operation for safe handling

    image.png

    3)使用标准晶片安装系统将键合晶片安装在切割框架上

    3)Bonded wafer stack is mounted to saw frame using standard wafer mounting systems


    image.png

    4)激光照射——通过激光照射进行脱胶,在LTHC层产生微小的空隙,使晶圆与玻璃可以进行分离。

    4)Laser Irradiation - The laser debond creates micro voids in the LTHC layer allowing for separation between glass support and wafer


    image.png

    5)移除支架——激光脱胶后,玻璃可轻易脱落,进行清洗后可循环使用。

    5)Remove Support - After laser debonding, the glass support lifts off easily and is cleaned and recycled for multiple uses


    image.png

    6)去除粘合剂——粘合剂很容易清除,几乎没有残留。

    6)Remove Adhesive - Adhesive layer removes easily, leaving minimal to no residue



    其中,光热转换(LTHC)层通过旋涂工艺可与WSS(临时键合/解键合)工艺一起搭配使用。而且,涂覆后玻璃载板的透光性也是可以通过验证的。

    The Light To Heat Conversion (LTHC) layer is applied via spin coating process and cured for use with the WSS process. Glass substrates are verified after coating for proper levels of light transmittal


          本文翻译转载自:https://smtnet.com/company/index.cfm?fuseaction=view_company&company_id=55969&component=catalog&catalog_id=21634

            

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